Sealed Power Choke-EH Series

Features
‧ Low profile.
‧ Various footprint in difference sizes for board designs.
‧ Magnetic shielded drum core construction with minimal power loss.
‧ Excellent solderability and high heat resistance.
‧ Low EMI and high current rating.
Model : EH Series

SIZE

Series

Inductance (uH)

DCR(Ω, ±30%.)

Irms(A, Max.)

Isat(A, Max.)

L

W

H

(range)

(range)

(range)

(range)

2.5

2.0

1.0

EH-2YY (SDI-2510D)

0.24-22.0

0.032-1.190

4.00-0.35

6.70-0.40

2.5

2.0

1.2

EH-3MY (SDI-2512D)

0.24-22.0

0.023-0.785

4.05-0.40

7.00-0.50

3.0

3.0

1.0

EH-1SY (SDI-0310D)

1.2-47.0

0.065-1.950

1.48-0.20

1.70-0.22

3.0

3.0

1.2

EH-3PY (SDI-0312D)

1.0-100.0

0.050-2.970

1.90-0.15

2.20-0.21

3.0

3.0

1.5

EH-1UY (SDI-0315D)

1.0-100.0

0.018-2.920

2.10-0.25

2.10-0.23

4.0

4.0

1.0

EH-1XY (SDI-0410D)

1.0-47.0

0.070-1.810

2.2-0.30

2.20-0.25

4.0

4.0

1.2

EH-1YY (SDI-0412D)

0.5-68.0

0.030-1.500

3.15-0.28

3.15-0.30

4.0

4.0

1.8

EH-2AY (SDI-0418D)

1.0-220.0

0.028-3.690

2.00-0.20

3.80-0.28

4.0

4.0

2.0

EH-5AY (SDI-0420D)

1.0-100.0

0.0384-1.755

2.15-0.31

4.85-0.52

4.0

4.0

2.6

EH-4FY (SDI-0426D)

1.0-68.0

0.0450-1.300

3.00-0.70

3.30-0.80

4.0

4.0

3.0

EH-4KY (SDI-0430D)

1.0-220.0

0.0325-3.500

4.00-0.25

6.00-0.33

5.0

5.0

1.2

EH-2DY (SDI-0512D)

1.0-22.0

0.0979-0.694

2.50-0.80

3.00-0.80

5.0

5.0

2.0

EH-2FY (SDI-0520D)

1.0-220.0

0.021-2.200

3.60-0.30

4.00-0.28

5.0

5.0

4.0

EH-2XY (SDI-0540D)

1.0-220.0

0.014-1.800

4.70-0.38

7.35-0.40

6.0

6.0

1.2

EH-2RY (SDI-0612D)

2.5-100.0

0.090-1.670

1.80-0.32

2.10-0.35

6.0

6.0

2.0

EH-2HY (SDI-0620D)

1.0-100.0

0.022-1.100

3.9-0.46

4.27-0.50

6.0

6.0

2.8

EH-2PY (SDI-0628D)

1.0-330.0

0.013-1.846

4.68-0.24

6.84-0.27

6.0

6.0

4.5

EH-2JY (SDI-0645D)

1.0-1000.0

0.012-5.200

5.50-0.18

10.50-0.24

8.0

8.0

4.0

EH-2KY (SDI-0840D)

0.9-820.0

0.007-2.800

7.24-0.34

12.42-0.36




Features

Low profile.

Various footprint in difference sizes for board designs.

Magnetic shielded drum core construction with minimal power loss.

Excellent solderability and high heat resistance.

Low EMI and high current rating.


Applications

DC/DC converters

Computers and PDAs

Mobile phones

PCMCIA cards

GPS systems

Digital cameras and DVD players