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DIP Molding power choke
SERIES
A
B
C
D
E
WΦ
LM-122
7.8±0.3
7.8±0.3
8.0 Max.
3.4±0.5
5.0
0.6~0.9
|
SMD or THT(PTH/DIP) |
SIZE |
New Part No. |
Old Part No. |
Inductance or (uH/nH/mH) |
Ω or uH/nH/mH |
DCR(Ω, Max.) |
Ω or mΩ |
IDC or Irms(mA, Max.) |
mA or A |
|
A(L) |
B(W) |
|||||||||
SMD |
8.3 |
8.3 |
LM-10A□072□□ |
MFG0810-1R0□ |
1.000 |
uH |
3.3 |
mΩ |
20 |
A |
SMD |
8.3 |
8.3 |
LM-12A□072□□ |
MFG0810-1R2□ |
1.200 |
uH |
3.7 |
mΩ |
18 |
A |
SMD |
8.3 |
8.3 |
LM-15A□072□□ |
MFG0810-1R5□ |
1.500 |
uH |
4.5 |
mΩ |
15 |
A |
SMD |
8.3 |
8.3 |
LM-20A□072□□ |
MFG0810-2R0□ |
2.000 |
uH |
5.2 |
mΩ |
13 |
A |
SMD |
8.3 |
8.3 |
LM-30A□072□□ |
MFG0810-3R0□ |
3.000 |
uH |
7.9 |
mΩ |
11 |
A |
SMD |
8.3 |
8.3 |
LM-80B□072□□ |
MFG0810-R80□ |
0.800 |
uH |
2.7 |
mΩ |
20 |
A |
•
Personal computers & Servers
• VGA cards
• DC/DC converters
• VRMs
•
Molding type with metal alloy powder construction.
• Large current and
shielded design.
• Low DC resistance
and low copper loss.
• Ultra low buzz
noise.